ThreeBond

Threebond International, Inc.

Creating our future from a single drop.
2200 Series

2200 Series

Industrial Epoxy Resins

usage

These ThreeBond adhesives use epoxy resin as their main component. They are excellent for a myriad of purposes including general purpose adhesion and sealing, and for electronic device bonding, filling, repair, casting and impregnation. Epoxy resins, also known as polyepoxides, are reactive prepolymers and polymers which contain epoxide groups. They often have favorable mechanical properties and high thermal and chemical resistance which make them ideal for a variety of industries and applications.

Many people choose epoxy resins because they are familiar, especially in an industrial setting. We most often see industrial epoxy resins being used in the following industries:

• Automotive aftermarket
• Small engine manufacturing
• Consumer electronics
• EV and fuel cell manufacturing

With a large array of different types of epoxy resins readily available, our selection allows us to serve our customers’ every need. With black and white options, varying degrees of viscosity and lap shear strength, our epoxy resins suit every job.

Why Choose ThreeBond Epoxy Resins?


As a business owner, you understand the importance of choosing the right supplies and materials the first time around. With such a huge selection of industrial epoxy resins, you can easily find solutions that will help to reduce overhead costs, reduce process steps, simplify the overall workflow and eliminate waste. We know that every dollar matters when it comes to working efficiently and we are here to be the partner you need to find the right solutions for every job.

Use our data sheets below to help you find the perfect epoxy resins for your industry and application.

UNIQUE PRODUCT CHARACTERISTICS

PRODUCT SPECIFICATIONS

( = download technical data sheet)

Product Name Features and Uses Color Viscosity (Pa*s) Lap Shear Strength (Mpa) Hardness Tg (C) Thermal Conductivity (W/mk) Curing
TB2202 Low Temperature curing one part epoxy, trigger cure type, excellent adhesive and heat resistance Black 13 10 D88 105 - 60C x 180min, 70C x 50min, 70C x 20min
TB2204 Low Temperature curing one part epoxy, trigger cure type, excellent adhesive and heat resistance Black 28 13 D89 105 - 60C x 180min, 70C x 50min, 70C x 20min
TB2206 Low Temperature curing one part epoxy, trigger cure type, excellent adhesive and heat resistance Black 100 15.7 D87 107 - 60C x 180min, 70C x 50min, 70C x 20min
TB2206B Low Temperature curing one part epoxy, trigger cure type, excellent adhesive and heat resistance Black 140 17.7 D89 102 - 60C x 180min, 70C x 50min, 70C x 20min
TB2206S Low halogen content Black 15 12 D87 106 - 80C x 30min
TB2222P Solder heat-resistant, highly-peel strength, thermal shock resistance, low linear expansion coefficient Black 45 24 D89 115 - 100C x 60min
TB2235L Heat -curable epoxy resin with High Tg and Storage Modulus. Suitable for applications where thermal resistance is required Black 80 23 D92 150 - 140C x 30min
TB2237J Heat -curable epoxy resin with High Tg and Elastic Modulus. Good adhesion to various substrates. Suitable for applications where thermal resistance is required White 115 26 D89 150 - 120C x 60min
TB2249G Heat-curable epoxy resin with High shear and peel strength Black 75 39 D90 104 - 160C x 30min
TB2249K Heat curable one epoxy resin. High adhesive strength, structural bonding. Good adhesion to oily surface. Black 880 34.6 D81 118 - 130C x 30 min
TB2270J High heat dissipation, one part epoxy. It has low linear expansion coefficient and cure shrinkage White 150 9 D96 117 4.2 100C x 40min
TB2272F Heat-curable epoxy resin , certified to UL94 V-0 flammability standard. Suitable for bonding and sealing parts around potential heat sources Black 75 21 D92 117 - 100C x 60min
TB2273E Heat-curable epoxy resin with High Tg, highly-peel strength and can be induction cured White 70 40 D94 120 - 150C x 30min
TB2274 Low Temperature curing one part epoxy for under-filling agent mounting CSP and BGA Black 12 11 D86 65 - 70C x 50min
TB2274C Low Temperature curing one part epoxy for under-filling agent mounting CSP and BGA Black 12 16 D83 80 - 85C x 60min
TB2285 High heat resistance, High Tg, for motor coil impregnation and fixing White 120 20 - 163 - 120C x 60min

* Measurements are taken under the standard testing conditions for each grade.

SUGGESTED MARKETS:

Automotive Aftermarket

Small Engine Manufacturing

Consumer Electronics Industry

EV & Fuel Cell Manufacturing

PLEASE NOTE: Not every product we make is represented here. If there is a product you don’t see, please contact us and we will provide information and specifications on request.

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